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TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841 1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803 Website: http: //www.microsemi.com
RADIATION HARDENED NPN SILICON SWITCHING TRANSISTOR
Qualified per MIL-PRF-19500/255
DEVICES
LEVELS
2N2221A 2N2221AL 2N2221AUA 2N2221AUB 2N2221AUBC
2N2222A 2N2222AL 2N2222AUA 2N2222AUB 2N2222AUBC
JANSM - 3K Rads (Si) JANSD - 10K Rads (Si) JANSP - 30K Rads (Si) JANSL - 50K Rads (Si) JANSR - 100K Rads (Si) JANSF - 300K Rads (Si) JANSG - 500K Rads (Si) JANSH - 1MEG Rads (Si)
ABSOLUTE MAXIMUM RATINGS (TC = +25C unless otherwise noted)
Parameters / Test Conditions Collector-Emitter Voltage Collector-Base Voltage Emitter-Base Voltage Collector Current Total Power Dissipation @ TA = +25C 2N2221A, L 2N2221AUA 2N2221AUB, UBC 2N2222A, L 2N2222AUA 2N2222AUB, UBC PT 0.5 0.65 0.50 -65 to +200 W Symbol VCEO VCBO VEBO IC Value 50 75 6.0 800 Unit Vdc Vdc Vdc mAdc
TO-18 (TO-206AA)
2N2221A, 2N2222A
Operating & Storage Junction Temperature Range
Top, Tstg
C
THERMAL CHARACTERISTICS
Parameters / Test Conditions Thermal Resistance, Junction-to-Ambient 2N2221A, L 2N2221AUA 2N2221AUB, UBC 1. 2. 2N2222A, L 2N2222AUA 2N2222AUB, UBC RJA 325 210 325 C/W Symbol Max. Unit
4 PIN
2N2221AUA, 2N2222AUA
Derate linearly 3.08 mW/C above TA > +37.5C Derate linearly 4.76 mW/C above TA > +63.5C
3 PIN
2N2221AUB, 2N2222AUB 2N2221AUBC, 2N2222AUBC (UBC = Ceramic Lid Version)
T4-LDS-0042 Rev. 3 (100247)
Page 1 of 7
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841 1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803 Website: http: //www.microsemi.com
ELECTRICAL CHARACTERISTICS (TA = +25C, unless otherwise noted)
Parameters / Test Conditions OFF CHARACTERISTICS Collector-Emitter Breakdown Voltage IC = 10mAdc Symbol Min. Max. Unit
V(BR)CEO
50
Vdc
Collector-Base Cutoff Current VCB = 75Vdc VCB = 60Vdc Emitter-Base Cutoff Current VEB = 6.0Vdc VEB = 4.0Vdc Collector-Emitter Cutoff Current VCE = 50Vdc
ICBO
10 10
Adc Adc
IEBO
10 10
Adc Adc
ICES
50
Adc
ON CHARACTERISTICS (3) Forward-Current Transfer Ratio IC = 0.1mAdc, VCE = 10Vdc 2N2221A, L, UA, UB, UBC 2N2222A, L, UA, UB, UBC 2N2221A, L, UA, UB, UBC 2N2222A, L, UA, UB, UBC 2N2221A, L, UA, UB, UBC 2N2222A, L, UA, UB, UBC 2N2221A, L, UA, UB, UBC 2N2222A, L, UA, UB, UBC 2N2221A, L, UA, UB, UBC 2N2222A, L, UA, UB, UBC hFE 30 50 35 75 40 100 40 100 20 30 0.3 1.0 120 300 150 325
IC = 1.0mAdc, VCE = 10Vdc
IC = 10mAdc, VCE = 10Vdc
IC = 150mAdc, VCE = 10Vdc
IC = 500mAdc, VCE = 10Vdc Collector-Emitter Saturation Voltage IC = 150mAdc, IB = 15mAdc IC = 500mAdc, IB = 50mAdc Base-Emitter Voltage IC = 150mAdc, IB = 15mAdc IC = 500mAdc, IB = 50mAdc
VCE(sat)
Vdc
VBE(sat)
0.6
1.2 2.0
Vdc
T4-LDS-0042 Rev. 3 (100247)
Page 2 of 7
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841 1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803 Website: http: //www.microsemi.com
DYNAMIC CHARACTERISTICS
Parameters / Test Conditions Small-Signal Short-Circuit Forward Current Transfer Ratio IC = 1.0mAdc, VCE = 10Vdc, f = 1.0kHz 2N2221A, L, UA, UB, UBC 2N2222A, L, UA, UB, UBC Magnitude of Small-Signal Short-Circuit Forward Current Transfer Ratio IC = 20mAdc, VCE = 20Vdc, f = 100MHz Symbol hfe Min. 30 50 Max. Unit
|hfe|
2.5
Output Capacitance VCB = 10Vdc, IE = 0, 100kHz f 1.0MHz Input Capacitance VEB = 0.5Vdc, IC = 0, 100kHz f 1.0MHz Cibo 25 pF Cobo 8.0 pF
SWITCHING CHARACTERISTICS
Parameters / Test Conditions Turn-On Time See figure 8 of MIL-PRF-19500/255 Turn-Off Time See Figure 9 of MIL-PRF-19500/255 (3) Pulse Test: Pulse Width = 300s, Duty Cycle 2.0%. Symbol ton Min. Max. 35 Unit s
toff
300
s
T4-LDS-0042 Rev. 3 (100247)
Page 3 of 7
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841 1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803 Website: http: //www.microsemi.com
PACKAGE DIMENSIONS
NOTES: 1. Dimensions are in inches. 2. Millimeters are given for general information only. 3. Beyond r (radius) maximum, TL shall be held for a minimum length of .011 inch (0.28 mm). 4. Dimension TL measured from maximum HD. 5. Body contour optional within zone defined by HD, CD, and Q. 6. Leads at gauge plane .054 +.001 -.000 inch (1.37 +0.03 -0.00 mm) below seating plane shall be within .007 inch (0.18 mm) radius of true position (TP) at maximum material condition (MMC) relative to tab at MMC. 7. Dimension LU applies between L1 and L2. Dimension LD applies between L2 and LL minimum. Diameter is uncontrolled in L1 and beyond LL minimum. 8. All three leads. 9. The collector shall be internally connected to the case. 10. Dimension r (radius) applies to both inside corners of tab. 11. In accordance with ASME Y14.5M, diameters are equivalent to x symbology. 12. Lead 1 = emitter, lead 2 = base, lead 3 = collector. 13. For L suffix devices, dimension LL = 1.5 inches (38.10 mm) min. and 1.75 inches (44.45 mm) max.
Symbol CD CH HD LC LD LL LU L1 L2 P Q TL TW r
Dimensions Inches Millimeters Min Max Min Max .178 .195 4.52 4.95 .170 .210 4.32 5.33 .209 .230 5.31 5.84 .100 TP 2.54 TP .016 .021 0.41 0.53 .500 .750 12.70 19.05 .016 .019 0.41 0.48 .050 1.27 .250 6.35 .100 2.54 .030 0.76 .028 .048 0.71 1.22 .036 .046 0.91 1.17 .010 0.25 45 TP 45 TP 1, 2, 9, 11, 12, 13
Note
6 7,8 7,8,13 7,8 7,8 7,8 5 3,4 3 10 6
FIGURE 1. Physical dimensions (similar to TO-18).
T4-LDS-0042 Rev. 3 (100247)
Page 4 of 7
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841 1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803 Website: http: //www.microsemi.com
NOTES: 1. Dimensions are in inches. 2. Millimeters are given for general information only. 3. Dimension CH controls the overall package thickness. When a window lid is used, dimension CH must increase by a minimum of .010 inch (0.254 mm) and a maximum of .040 inch (1.020 mm). 4. The corner shape (square, notch, radius) may vary at the manufacturer's option, from that shown on the drawing. 5. Dimensions LW2 minimum and L3 minimum and the appropriate castellation length define an unobstructed three-dimensional space traversing all of the ceramic layers in which a castellation was designed. (Castellations are required on the bottom two layers, optional on the top ceramic layer.) Dimension LW2 maximum and L3 maximum define the maximum width and depth of the castellation at any point on its surface. Measurement of these dimensions may be made prior to solder dipping. 6. The co-planarity deviation of all terminal contact points, as defined by the device seating plane, shall not exceed .006 inch (0.15mm) for solder dipped leadless chip carriers. 7. In accordance with ASME Y14.5M, diameters are equivalent to x symbology.
Symbol BL BL2 BW BW2 CH L3 LH LL1 LL2 LS LW LW2
Dimensions Inches Millimeters Min Max Min Max .215 .225 5.46 5.71 .225 5.71 .145 .155 3.68 3.93 .155 3.93 .061 .075 1.55 1.90 .003 .007 0.08 0.18 .029 .042 0.74 1.07 .032 .048 0.81 1.22 .072 .088 1.83 2.23 .045 .055 1.14 1.39 .022 .028 0.56 0.71 .006 .022 0.15 0.56
Note
3 5
5
Pin no. Transistor
1 Collector
2 Emitter
3 Base
4 N/C
FIGURE 2. Physical dimensions, surface mount (UA version).
T4-LDS-0042 Rev. 3 (100247)
Page 5 of 7
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841 1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803 Website: http: //www.microsemi.com
UB
Symbol BH BL BW CL CW LL1 LL2
Dimensions Inches Millimeters Min Max Min Max .046 .056 1.17 1.42 .115 .128 2.92 3.25 .085 .108 2.16 2.74 .128 3.25 .108 2.74 .022 .038 0.56 0.96 .017 .035 0.43 0.89
Note
Symbol LS1 LS2 LW r r1 r2
Dimensions Inches Millimeters Min Max Min Max .036 .040 0.91 1.02 .071 .079 1.81 2.01 .016 .024 0.41 0.61 .008 .203 .012 .305 .022 .559
Note
NOTES: 1. Dimensions are in inches. 2. Millimeters are given for general information only. 3. Hatched areas on package denote metalized areas. 4. Pad 1 = Base, Pad 2 = Emitter, Pad 3 = Collector, Pad 4 = Shielding connected to the lid. 5. In accordance with ASME Y14.5M, diameters are equivalent to x symbology.
FIGURE 3. Physical dimensions, surface mount (UB version)
T4-LDS-0042 Rev. 3 (100247)
Page 6 of 7
TECHNICAL DATA SHEET
6 Lake Street, Lawrence, MA 01841 1-800-446-1158 / (978) 620-2600 / Fax: (978) 689-0803 Website: http: //www.microsemi.com
UBC
Symbol BH BL BW CL CW LL1 LL2
Dimensions Inches Millimeters Min Max Min Max .046 .071 1.17 1.80 .115 .128 2.92 3.25 .085 .108 2.16 2.74 .128 3.25 .108 2.74 .022 .038 0.56 0.96 .017 .035 0.43 0.89
Note
Symbol LS1 LS2 LW r r1 r2
Dimensions Inches Millimeters Min Max Min Max .036 .040 0.91 1.02 .071 .079 1.81 2.01 .016 .024 0.41 0.61 .008 .203 .012 .305 .022 .559
Note
NOTES: 1. Dimensions are in inches. 2. Millimeters are given for general information only. 3. Hatched areas on package denote metalized areas. 4. Pad 1 = Base, Pad 2 = Emitter, Pad 3 = Collector, Pad 4 = Connected to the lid braze ring. 5. In accordance with ASME Y14.5M, diameters are equivalent to x symbology.
FIGURE 4. Physical dimensions, surface mount (UBC version, ceramic lid)
T4-LDS-0042 Rev. 3 (100247)
Page 7 of 7

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